Indian scientists have submitted a detailed project report to the government, outlining plans to develop cutting-edge semiconductor materials that could revolutionize chip manufacturing. The proposal, led by a team from the Indian Institute of Science (IISc), focuses on creating angstrom-scale chips using advanced 2D materials like graphene and transition metal dichalcogenides.
The initiative aims to surpass existing silicon-based technologies, positioning India as a leader in the post-silicon era. The project seeks funding of Rs 500 crore over five years to establish indigenous semiconductor technology, reducing reliance on foreign manufacturers.
Key Highlights:
- The IISc team has proposed developing chips far smaller than the current 3-nanometer nodes in production.
- The project emphasizes the use of ultra-thin materials to enable fabrication at the angstrom scale.
- The Principal Scientific Adviser and the Ministry of Electronics and IT are reviewing the proposal for potential implementation.
- India currently depends on global players for semiconductor manufacturing, making this initiative a strategic move for economic and national security.
- The government is exploring applications for this technology in electronics and computing, aiming to strengthen India’s semiconductor ecosystem.
With global interest in 2D materials growing, India’s push for next-generation semiconductor technology could pave the way for breakthroughs in computing and electronics.
Source: Economic Times, Press Information Bureau, MSN News